An Intra - Chip Free - Space Optical Interconnect : Extended Technical Report ∗

نویسندگان

  • Jing Xue
  • Alok Garg
  • Berkehan Ciftcioglu
  • Jianyun Hu
  • Shang Wang
  • Ioannis Savidis
  • Manish Jain
  • Rebecca Berman
  • Peng Liu
  • Michael Huang
  • Hui Wu
  • Eby Friedman
  • Gary Wicks
  • Duncan Moore
چکیده

Continued device scaling enables microprocessors and other systems-on-chip (SoCs) to increase their performance, functionality, and hence, complexity. Simultaneously, relentless scaling, if uncompensated, degrades the performance and signal integrity of onchip metal interconnects. These systems have therefore become increasingly communications-limited. The communications-centric nature of future high performance computing devices demands a fundamental change in intraand inter-chip interconnect technologies. Optical interconnect is a promising long term solution. However, while significant progress in optical signaling has been made in recent years, networking issues for on-chip optical interconnect still require much investigation. Taking the underlying optical signaling systems as a drop-in replacement for conventional electrical signaling while maintaining conventional packetswitching architectures is unlikely to realize the full potential of optical interconnects. In this paper, we propose and study the design of a fully distributed interconnect architecture based on free-space optics. The architecture leverages a suite of newly-developed or emerging devices, circuits, and optics technologies. The interconnect avoids packet relay altogether, offers an ultra-low transmission latency and scalable bandwidth, and provides fresh opportunities for coherency substrate designs and optimizations. This paper is an extended version of the conference paper that appears in ISCA 2010.

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تاریخ انتشار 2011